Electric power distribution center having a plurality of ASICS each with a voltage to frequency converter that use an RMS current value

ABSTRACT

An electrical power distribution system is disclosed that includes a gateway module ( 100 ) including logic ( 112 ) to interface to a vehicle management computer (VMC) ( 50 ) via a dual redundant standard data bus ( 1 ). The gateway module ( 100 ) has redundant microcontrollers ( 114, 116 ) operably connected to the VMC ( 50 ) for selectively controlling supply of electrical power to a plurality of separate electrical loads ( 120 ). A plurality of Load Management Modules ( 300 ) is provided. Each Load Management Module ( 300 ) includes a local microcontroller ( 310 ); power switching devices ( 320 ); and application specific integrated circuits ASICs ( 330 ) for interfacing the power switching devices ( 320 ) to the local microcontroller ( 310 ). Each ASIC ( 330 ) can be connected to a corresponding digital potentiometer ( 600 ) that is used to program an over current protection characteristic. Additionally, each ASIC ( 330 ) can include a voltage to frequency converter ( 381 ) that provides a true RMS current value to the local microcontroller ( 310 ).

RELATED APPLICATION

This application is a Divisional and claims priority under 35 U.S.C. §120 of application Ser. No. 10/299,388, filed on Nov. 19, 2002, now U.S.Pat. No. 7,007,179, which claims priority under 35 U.S.C. §119(e) ofU.S. Provisional Application No. 60/381,067 filed on May 16, 2002 andunder 35 U.S.C. §120 as a continuation-in-part of application Ser. No.10/017,125 filed on Dec. 14, 2001, now U.S. Pat. No. 7,020,790, whichclaims priority under 35 U.S.C. § 119(e) of U.S. Provisional ApplicationNo. 60/267,520 filed on Feb. 8, 2001. The entire contents of theserelated applications are hereby incorporated by reference.

FIELD OF THE INVENTION

The present invention relates to power management and electric powerdistribution systems for applications having multiple ,separatelycontrolled electrical loads.

BACKGROUND OF THE INVENTION

Electrical power controllers have been used for the distribution ofelectrical power on aircraft and other vehicles. Additionally, modularapproaches to supply vehicle power have been used to facilitate bothmaintenance and operability under fault conditions.

New generation vehicles have significantly different electric powerrequirements. For example, in aerospace systems, there has been afundamental paradigm shift from predominantly mechanical orelectromechanical control to predominantly electronic and computer-basedcontrol, with no or minimal backup. This shift toward fly-by-wiresystems has been pioneered in Europe by Airbus and now encompassessafety-critical systems.

This shift in technology poses fundamental technical and commercialchallenges, which require advanced power distribution controllers suchas an Electric Load management Center (ELMC). Advances in switchingtechnology (solid state) and computer control now offer the potentialfor fully automated electric power systems (EPS). A combination of solidstate power controllers (SSPC), remote power controllers, smartcontactors, and automatic system processors has evolved into ELMC.

As computer-controlled system technology advances more system functions,including power control, fall under computer-controlled command. A moreadvanced technology in the power control and protection is making itsway into aerospace power systems to replace mechanical circuit breakersand relays.

U.S. Pat. No. 5,752,047 issued to Darty et al. discloses a modular solidstate power controller with microcontrollers. The modular solid statepower controller includes low cost low speed microcomputers embeddedwithin the load cards to control a number of semiconductor powerswitches associated with corresponding electrical load circuits. Amaster controller microcomputer on the controller card communicatesbilaterally with each of the microcomputers embedded within the loadcards via a serial data path that extends along the backplane card andinterconnects the controller microcomputer with each of the load cards.Each of the load cards includes semiconductor power switches associatedwith the respective slave card, which are activated upon commands issuedfrom the controller microcomputer.

However, the Darty et al. design utilizes discrete components to providelimited control of the power switches. Therefore, this modular solidstate power controller with microcomputers is limited to basic on/offcontrol of the power switches and does not permit local controlfunctionality and flexible configuration of the SSPCs.

Therefore, it is desired to have an ELMC that includes integratedadvanced power switch controllers that interface with the localmicrocontrollers and allow for additional control and configuration ofeach individual power switch.

SUMMARY OF THE INVENTION

In accordance with the present invention, the deficiencies in priorsystems are overcome by providing an electrical power distributioncenter comprising: a gateway module including logic to interface to avehicle management computer (VMC) via a dual redundant standard databus, wherein the gateway module comprises redundant microcontrollersoperably connected to the VMC for selectively controlling supply ofelectrical power to a plurality of separate electrical loads; twointernal serial data buses, wherein the two internal serial data busesare of two different types and the redundant microcontrollers are eachoperably connected to the two internal serial data buses; and aplurality of Load Management Modules (LMMs), each Load Management Moduleoperably connected to the internal serial data buses for receivingcontrol commands from the gateway module, wherein each Load ManagementModule comprises: a local microcontroller; a plurality of powerswitching devices; and a plurality of application specific integratedcircuits (ASICs) corresponding to the plurality of power switchingdevices for interfacing the power switching devices to the localmicrocontroller, wherein each ASIC is connected to a correspondingdigital potentiometer that is used to program an over current protectioncharacteristic of the ASIC.

Additionally, the present invention provides an electrical powerdistribution center comprising: a gateway module including logic tointerface to a vehicle management computer (VMC) via a dual redundantstandard data bus, wherein the gateway module comprises redundantmicrocontrollers operably connected to the VMC for selectivelycontrolling supply of electrical power to a plurality of separateelectrical loads; two internal serial data buses, wherein the twointernal serial data buses are of two different types and the redundantmicrocontrollers are each operably connected to the two internal serialdata buses; and a plurality of Load Management Modules (LMMs), each LoadManagement Module operably connected to the internal serial data busesfor receiving control commands from the gateway module, wherein eachLoad Management Module comprises: a local microcontroller; a pluralityof power switching devices; and a plurality of application specificintegrated circuits (ASICs) corresponding to the plurality of powerswitching devices for interfacing the power switching devices to thelocal microcontroller, wherein each ASIC includes a voltage to frequencyconverter that converts a true RMS current value to a correspondingfrequency that is provided to the local microcontroller.

Still further, the present invention provides an electrical powerdistribution center comprising: a gateway module including logic tointerface to a vehicle management computer (VMC) via a dual redundantstandard data bus, wherein the gateway module comprises redundantmicrocontrollers operably connected to the VMC for selectivelycontrolling supply of electrical power to a plurality of separateelectrical loads; two internal serial data buses. The two internalserial data buses are of two different types and the redundantmicrocontrollers are each operably connected to the two internal serialdata buses. A plurality of Load Management Modules (LMMs) are provided.Each Load Management Module is operably connected to the internal serialdata buses for receiving control commands from the gateway module. EachLoad Management Module comprises: a local microcontroller; a pluralityof power switching devices; and a plurality of application specificintegrated circuits (ASICs) corresponding to the plurality of powerswitching devices for interfacing the power switching devices to thelocal microcontroller. Each ASIC includes a decoder for decoding achannel ID that determines which of the plurality of power switchingdevices will be activated. Further scope of applicability of the presentinvention will become apparent from the detailed description providedhereinafter.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete understanding of the present invention will becomeapparent from the following description taken in conjunction with theaccompanying drawings, wherein:

FIG. 1 comprising FIG. 1 a and FIG. 1 b illustrates a modulararchitecture in accordance with an aspect of the present invention;

FIG. 2 illustrates a block diagram of the ELMC communication with thevehicle in accordance with an aspect of the present invention;

FIG. 3A comprising FIG. 3Aa and FIG. 3Ab illustrates a block diagram ofa Load Management Module in accordance with an aspect of the presentinvention;

FIG. 3B comprising FIG. 3Ba, FIG. 3Bb and FIG. 3Bc illustrates a blockdiagram of logic in an application specific integrated circuit inaccordance with an aspect of the present invention;

FIG. 4 illustrates packaging of the ELMC in accordance with an aspect ofthe present invention;

FIG. 5 illustrates a programmable trip function in accordance with anaspect of the present invention; and

FIG. 6 illustrates a current reporting function in accordance with anaspect of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Aspects of the invention are disclosed in the following description.Those skilled in the art will appreciate that alternate embodiments canbe devised without departing from the spirit or the scope of theinvention.

The Electrical Load Management Center (ELMC) is responsible for thedistribution of electrical power to the vehicle. It also can supplycontrol logic for some vehicle systems. Thus, the ELMC replaces complexrelay logic and circuit cards that are part of the traditionalsubsystems control. Additionally, the ELMC can provide statusinformation to an electrical power system display to provide a real timepicture of the electrical power system configuration.

By reducing system complexity and increasing system functionality, theELMC provides lower system weight, higher reliability, higher systemavailability, better maintainability and lower cost of ownership to theend user.

As mentioned above, modern vehicles have significantly differentelectric power requirements. These requirements include remotecontrol/interfacing with vehicle management computers, increasedreliability, fault tolerance (e.g., to cover for powered-by-wires orfly-by-wires implementations and features), increased electrical powerdemands and reduced direct maintenance cost (DMC).

The ELMC incorporates control, protection, and built-in test (BIT)functions for improved availability and maintainability. The ELMC caninterface with a higher-level management computer for command controland status reporting. The power and control hardware are carefullydesigned for compatibility into current vehicle (e.g., aircraft) systemssuch that it provides the power flow and status data while optimizingsize, weight, and efficiency constraints.

Additionally, the ELMC in accordance with the present inventions hasvarious fault detection and isolation functions. The ELMC has theability to test, monitor and report on system (e.g., electric power)health and to individually identify failed solid state switching devices(SSSDs)/power switching devices (PSDs) in specific LMMs to minimizemaintenance efforts on the entire vehicle.

Another aspect of the present invention is the ELMC configured as a LineReplaceable Unit (LRU) used in the distribution of electrical power forairborne, seaborne, land or space vehicles. In this context, the termdistribution includes but is not limited to the switching of power fromvarious power buses within the ELMC, the protection of wiring downstreamof the power switching devices, the reporting back of the status of thepower switching devices, and provision of load management functions suchas load shedding, sequencing of load switching, and the like.

The above-mentioned ELMC is built on a modular architecture concept forflexibility. The ELMC contains LMMs and other circuit cards to provideconditioned power supply, analog and digital signal conditioning andinterfacing with the host vehicle through a gateway module andassociated controller.

A LMM is a circuit card assembly that contains a plurality of solidstate switching devices/power switching devices. The LMM is used toswitch AC or DC power, protect the wiring from overcurrent conditionsand distribute the power to utilization equipment. The LMM can replacehybrid solid state power controllers or the combination of relay andcircuit breakers. The SSSD and LMM are modular in design itself so thateach can be applied to many applications. A microcontroller, alsolocated on the LMM, interfaces the SSSDs with the gateway module. EachSSSD includes a mixed technology Application Specific Integrated Circuit(ASIC) that controls switch drivers, monitoring and overcurrentprotection functions, and the like. Each power switching device (PSD),installed on the LMM provides line power switching and is controlled byan ASIC.

An exemplary embodiment of a modular architecture according to thepresent invention is shown in FIG. 1 comprising FIGS. 1A and 1B. Agateway module 100 including logic 112 to interface to a vehiclemanagement computer (VMC) 50 via a dual redundant standard data bus 1.The term “logic” as used herein refers to any combination of hardware,software and or combinations of hardware and software to implement theassociated function, as will be appreciated by those skilled in the art.The gateway module 100 comprises redundant microcontrollers 114, 116operably connected to the VMC 50 for selectively controlling supply ofelectrical power to a plurality of separate electrical loads 120. Thecommunication with the VMC 50 is implemented by any suitable serialcommunication such as ARINC 429, ARINC 629, MIL-STD-1 553, Avionics FullDuplex Switch Ethernet (AFDX), and the like. In the modular design ofpresent invention, only the gateway module 100 is modified toaccommodate a new communication protocol.

Within the ELMC, two types of serial data buses 2, 3 are used forintra-ELMC communication. The redundant microcontrollers 114, 116 areeach operably connected to the two internal serial control buses 2, 3.In this example, the two internal serial data buses are SynchronousSerial Peripheral Interface (SPI) and Asynchronous Serial CommunicationsInterface (SCI), which were chosen for dissimilarity purposes. The SPIis a high-speed communication, full-duplex, three-wire synchronoustransfer bus. The SCI is a serial UART type asynchronous communicationbus, full-duplex, single wire operation mode. As the ELMC motherboard isthe critical common link between gateway module and LMMs, the twocommunication buses provide dual redundancy and reduce occurrence rateof a common mode failure. Dissimilar control and communicationtechniques are used in critical systems to reduce common mode failures.For example, an undetected software error (e.g., virus, bug and thelike) will affect one system but not be replicated by or affect theother.

External discrete and analog input signals 4 can be fed to the gatewaymodule 100 and LMMs 300 for subsystem control. A plurality of LMMs 300including local microcontroller 310 is shown. Each Load ManagementModule 300 is operably connected to the internal serial data buses 2, 3for receiving control commands via the gateway module 100.

Referring to FIG. 2, a block diagram of the gateway module is shown.Critical components are replicated to achieve fault tolerance, such asthe microcontroller having a dual-redundant channel. The gateway module100 contains one low cost microcontroller 114, 116 per channelinterfaced to the data bus remote terminal interfaces 214, 216,respectively. These communicate with microcontrollers 114, 116 via aninternal control bus 230. Redundant control logic 240 providessupervisory control and decides which of the channels (both aresimultaneously active) are in control at any particular time. Thoseskilled in the art will appreciate that the gateway module 100 isinterconnected such that either microcontrollers 114, 116, cancommunicate with the VMC 50 via the redundant data bus 1 and the LMMs300 using either of the internal serial data buses 2, 3. Thus, a failureof any one of these components does not prevent operation of the ELMC.

A block diagram of a Load Management Module 300 is shown in FIG. 3Acomprising FIGS. 3Aa and 3Ab. Each Load Management Module includes alocal microcontroller 310, a plurality of power switching devices 320,and a plurality of application specific integrated circuits (ASICs) 330corresponding to the plurality of power switching devices forinterfacing the power switching devices 320 to the local microcontroller310.

The LMMs are packaged in a manner that minimizes cost and thermaldissipation when compared to conventional devices. At the LMM level, thelocal monitoring is based on channel tracing. One advantage of thisapproach is that the system behavior can be observed without intrusion.Those skilled in the art will appreciate that this approach requiresadditional software that observes application tasks during runtime andtraces task states, discrete values, and the like.

To achieve a higher level of integration, these features and associatedcircuits are incorporated in a mixed technology ASIC 330, as shown inFIG. 3B comprising FIGS. 3Ba, 3Bb and 3Bc. The ASIC 330 incorporates andpackages load switching and protective functions. These functions areenabled by related “logic”, which as noted above refers to anycombination of hardware, software and or combinations of hardware andsoftware to implement the associated function, as will be appreciated bythose skilled in the art. It covers both AC and DC modes andapplications with various current ratings. Mode selection isaccomplished by connecting a mode select pin 331 to a correspondinglogic level. For example, the default mode (not connected) is AC.

Power up reset logic 332 executes an internal reset and calibrationcycle during a power-up sequence, to increase the accuracy overtemperature and aging ranges. Examples of additional functions/circuitsof the ASIC 330 include: gate driver 333 for providing a gating on ofthe PSD in response to a command signal; providing I²t characteristics334; fast shut down (i.e., instant trip function) 335; providing realtime status of the power switching device; and tailoring of powerswitching functions to control or limit the rate of change of thecurrent during switching (e.g., soft turn on off for DC and zero voltagecrossing turn on/zero crossing current turn off for AC).

Each ASIC 330 also includes an analog signal processing block 338 thatconditions a load current sense voltage across the shunt resistor 322 toproduce a true RMS current value via RMS value calculation logic 337.Those skilled in the art will appreciate that a true RMS current is nota trivial value to obtain, especially in switched power systems wherethe DC current is not pure DC current and the AC current is not purelysinusoidal containing only one frequency. However, the true RMS currentis critical for calculating RMS heating and I²t values related tothermal limits of protected components and protected wiring. Forexample, each ASIC includes an analog processor 334 that uses the I²tvalue to control variable trip times (i.e., removing power from the downstream devices) under different application configurations (e.g.overcurrent for a calculated period of time based on I²t formula).

As described above, each ASIC includes zero-crossing currentprocessing/detection 339 and zero-crossing voltage processing/detection341. Zero-crossing voltage detection is done in a centralized location(e.g. power supply module). It represents a square waveform, in phasewith the AC line voltage (so it follows the period and phase of the ACline voltage—constant or variable frequency). The zero-crossing currentprocessing/detection 339 and zero-crossing voltage processing/detection341 are used for controlling on/off activation and respectivedeactivation timing of the corresponding power switching device whenoperating in an AC mode. Those skilled in the art will appreciate that asoft-start function is used when operating in a DC mode. The soft startcan be a simple ramp function, log function, S-function and the like asis well known in the art.

Further, unlike prior designs, the design of the ELMC allows individualASICs 330 to be coordinated thereby allowing ganged operation. Asillustrated in FIG. 3A, the LMM 310 has a plurality (e.g., eight asshown) of power switching devices 320 and corresponding ASICs 330. Forexample, three ASICs 330 can be gang operated in an AC mode to control athree-phase power source. Prior systems, such as the previouslymentioned U.S. Pat. No. 5,752,047, have no practical way to controlmulti-phase loads in a coordinated manner. Those skilled in the art willappreciate software controls that allow for ASICs 330 to be gangoperated will coordinate the operation of each ganged ASIC with theother ganged ASIC 330. For example, in ganged operation a command toactivate one of PSDs controlled by one of the ganged ASICs will act toactivate the other PSDs associated with the other ganged ASICs.Additionally, other related functions are coordinated in gangedoperation (e.g., trip, status, and the like) are well known in the artand will not be detailed herein.

As shown in FIG. 3Ab, the local microcontroller 310 is isolated from theASIC's 330 high voltage side driver and power lines using opto-couplers340. Redundant power supplies, 342, 344 energize the individual ASICchannels and preserve isolation. The redundant power supplies 342, 344are isolated low power DC to DC converters that supply power to theASICs 330. DC to DC converters are well know in the art and will not bedescribed further herein.

The opto-couplers 340 contain various individual couplers that providean isolated communication bridge between the microcontroller 310 andASICs 330. One of the signals passed from the microcontroller 310 to theASICs 330 is a Channel ID signal, as shown in FIG. 3Ba, that is decodedby decoder 345 to enable the appropriate ASIC 330. Accordingly, eachASIC 330 has an associated Channel ID (e.g., 1-n), which corresponds tothe PSD 320 controlled by the respective ASIC 330. Therefore, theChannel ID signal can be broadcast to all ASICs 330 along with theappropriate commands and only the desired PSD 320 will be activated. Theaddress (channel ID), generated by the VMC 50, is compared with thewired location ID 347 of the ASIC 330 and when they match theinformation is passed inside the ASIC 330. For example, the VMC 50transmits the address of a device and a command for that device to theappropriate ASIC 330 via the gateway module 100 and localmicrocontroller 310. The data from the VMC 50 is passed to the internalserial bus via the gateway module 100. The serial communication on theinternal bus is received by the local microcontroller 310 and relayedinternally to the ASICs 330, wherein each ASIC 330 compares the address(channel ID) associated with the information to its wired location ID347. Upon a positive match of the address and wired location ID 347, theassociated information is received by ASIC 330 for subsequent processing(e.g., activating PSD 320).

The same approach (using encoders 346 this time) can be used to reportback to the microcontroller and VMC monitoring data. Those skilled inthe art will appreciate that these serial communication techniquesminimize the number of the opto-couplers for a system with multiplechannels.

PSDs 320 can use hermetic components and packaging for extremeenvironmental conditions or can use plastic packages for commercialapplications. The PSDs 320 use power MOSFET technology to minimize powerdissipation from the power switching devices and provide both AC and DCcapabilities. Each PSD contains at least one transistor/switching device(not shown), a sense resistor (shunt) 322 and a temperature sensor 324.Each ASIC 330 includes a thermal shut-down circuit 336, as shown in FIG.3B, that opens the corresponding power switching device when thesubstrate of the power switching device exceeds a predeterminedreference temperature, as detected by temperature sensor 324. Thepredetermined reference temperature can be adjusted using an externalsetting resistor (not shown). Since the operation of the ELMC reliesheavily on the integrity of the PSDs 320, the junction temperature ofeach PSD 320 should be maintained in its safe operating area. To achievethis a careful selection of the amount of silicon and optimization ofthe thermal path for the power semiconductors was undertaken. The LMM310 design provides for adequate cooling and incorporates a thermal shutdown protective feature for the PSDs 320 via the associated ASICs 330,as described above.

In another embodiment, the wire bonds in the individual MOSFETtransistors are designed to act as a fusible link in series with thetransistor. One of the inherent weaknesses in MOSFET transistors is ashort circuit that forms between the drain and source when the devicefails. In a power switching and protection device this failure mode canbe catastrophic for the protected (e.g., load, wiring, etc.) devices.Therefore, designing the wire bonds to act as fusible links can mitigatethe damage to the protected devices. Applying similar design rules asused in designing a fuse (e.g., I²t calculated under the safe operatingarea of the protected wiring), the MOSFET wire bonds can be designed toprovide a delayed fuse for the nominal current rating of the SSSD (e.g.,a fourteen amp fuse for a ten amp nominal rated device). Those skilledin the art will appreciate that the specific design criteria isdependent on a number of factors such as wire bond material, anticipatedambient and operating temperatures, and the like. Additionally, sinceMOSFETs are good current sharing devices when connected in parallel,paralleling the fusible links will also apply to the designconsiderations.

ELMC packaging can be implemented as in FIG. 4. In this particular casethe ELMC contains a relay LMM card 405, five AC SSSD LMMs 406 to 410,one power supply card 411, one Electronic Load Contactor Unit (ELCU)card 412, five DC SSSD LMMs 413 to 417 and a gateway card 418. The relaycard is built in a similar way as the SSSD LMM. It contains a pluralityof 2 pole double throw (PDT) switches for one phase AC or DCapplications, 4PDT switches for AC three phase applications andassociated relay drivers controlled by the local microcontroller.Associated monitoring circuitry is provided as required. An ELCU card isprovided to control a plurality of electromechanical contactors outsideELMC. The ELCU card is built similar to the SSSD LMM. The SSSD is usedas contactor coil driver. The ASIC monitors the current conductedthrough contactor's poles and associated monitoring in a similar fashionas described above. The circular connectors 421 on the front of thechassis are the electrical interfaces with the host vehicle. Theinternal communication, signal conditioning and internal power suppliesto the LMMs are handled by a motherboard card 419 on the bottom half ofthe chassis. All power lines and distribution lines are wired on theother half of the bottom using a backplane 420.

As previously discussed, each LMM includes an embedded microcontrollerto control and monitor a number of the SSSDs. The LMM can work as astand-alone module communicating with other subsystem processors via aserial data bus or can communicate with the gateway module card via theserial data bus that extends along the motherboard 419. Those skilled inthe art will appreciate that the individual LMM system architecture isdesigned to accommodate the capability of making local decisions basedon a limited number of inputs available.

FIG. 5 illustrates a programmable aspect of the trip function of theASIC 330. Since the SSPC of the LMMs are typically designed for discretepower ranges (e.g., 5, 15 and 25 amps), it is desired to have a way toprogram the ASIC to trip at level in between the discrete power ranges.For example, a 25 amp system could be supplied for a load that onlyrequired 20 amps. Accordingly, the trip conditions should be adjusted toreflect the 20 amp requirement and not the full 25 amps of the module.Therefore, a digitally controlled potentiometer 600 is provided tointerface with the previously described ASIC 330 to adjust the I²tcharacteristic and instantaneous trip function.

The digitally controlled potentiometer 600 comprises a non-volatilememory 601 and a programmable potentiometer 602. Those skilled in theart will appreciate that this a simplified version of the digitalpotentiometer 600 and that such devices and equivalent variableresistors are commercially available. Accordingly, the invention is notlimited to this specific device, but could utilize any device thatprovided for a similar function. In this example, the position of thewiper 603 is stored in non-volatile memory 601, which is recalled uponevery subsequent power-up operation. The component selection (i.e.,Address of the digital potentiometer that corresponds to the ASIC thatis to be programmed), direction of the wiper movement (Sense) and numberof increments (Increment) are sent from the local microcontroller viaopto-couplers to preserve galvanic isolation of the low voltage sidecomponents. The resistance value (R-value) of the programmablepotentiometer 601 is provided as feedback to the microcontroller fromthe digital potentiometer 600. Those skilled in the art will appreciatethat the communication (e.g., R-value, Sense, Increment, Address)between the digital potentiometer 600 and the local microcontroller/VMCcan be performed using the serial addressing, decoding and encodingtechniques previously described to reduce the number of independentcommunication lines that need to be isolated. Alternatively, thesecommunications can be performed using independent lines, or combinationsof these techniques as best fits the system design parameters (e.g.,number of channels, data communicated, number of opto-couplersavailable, circuit board size, and the like)

By varying the resistance value of programmable potentiometer 601 thatis connected to the TRIP_PROG input of the ASIC 330, an amplifier gaincan be programmed by the digital potentiometer 600, in order to scalethe current reading to a corresponding rating of the trip curve).Additionally, fail-safe resistor 610 can be provided to prevent an opencircuit condition from occurring should the digital potentiometer 600fail. For example, the fail-safe resistor 610 can correspond to theminimum current rating the PSD associated with ASIC 330. By programmingthe over current protection characteristic of the ASIC with an externaldigital potentiometer 600, the processing load on the ASIC is reduced asis the communications requirements between the ASIC and themicrocontroller. Further, since the digital potentiometer has anon-volatile memory that stores the set value, the trip position can beset once and not reprogrammed until it is required by a changedcondition. Accordingly, the system does not have to reload the devicetrip parameters after every power-up/reset sequence as is required inprior art systems.

Referring to FIG. 6, a block diagram of current reporting function ofthe present invention is shown. The current is detected from the shuntresistor 322 inside the PSD and is processed by ASIC 330 to produce atrue RMS current value, as previously described. The true RMS currentvalue is used for the I²t calculations. Additionally, this true RMScurrent value is converted in voltage to frequency converter 381 to afrequency. The frequency output is passed through opto-coupler 382 toisolate the low voltage and high voltage components, thereby maintainingthe galvanic isolation between the ASIC and local microcontroller. Theisolated frequency is provided to the microcontroller to provide thetrue RMS current value to the microcontroller. A basic accumulator canbe used to convert the frequency input into a digital value representingthe true RMS current value. However, those skilled in the art willappreciate other methods for converting the frequency signal into adigital value exist and could be used to supply the RMS current value tothe microcontroller.

Further, the LMM's can be interfaced to additional devices, logic andthe like, by interfacing to the local microcontroller 310. The localmicrocontroller 310 can be interfaced with via analog and discretesignals 4 at the embedded analog to digital converters and logic I/O,via interrupt (IRQ) ports, and via the serial communication buses 2, 3.For example, a ground fault interrupter (GFI) function can be interfacedto the local microcontroller 310 to further protect personnel andequipment (by switching off the associated PSD). Additionally, an ArcFault Detection (AFD) function can be used to protect wiring in aircraftor other vehicle. Logic functions processed outside the distributionsystem can be interfaced to the local microcontroller 310 in the samemanner. For example, a fan needs to be turned off 60 seconds delay afterthe temperature reaches a low threshold or the power needs to beswitched off if two discrete signals are both at high logic levels.These types of logic functions are easily performed in the localmicrocontroller. Therefore, some of the relay logic otherwise needed tocontrol these operations can be eliminated by providing these signals tothe local microcontroller via input through the external discrete andanalog input signals 4. Those skilled in the art will appreciate thatcommercially available microcontrollers such as the Motorola 68HC912series have integrated analog and digital input capability that allowfor the above-described operations. Therefore, details of the interfacewill not be further described herein.

The foregoing merely illustrates the principles of the invention. Itwill be appreciated that those skilled in the art will be able to devisevarious arrangements, which, although not explicitly described or shownherein, embody the spirit and scope of the present invention. Forexample, each component described can be used as a complete unit (e.g.,LRU) or as a module (e.g., a line replaceable module LRM). In addition,the ASIC, combined with the PSD and associated electronics can bepackaged in hybrid case to provide a single solid state power controllerfunction. Therefore, the scope of the invention is not limited by theforegoing description but is defined solely by the appended claims.

1. An electrical power distribution center comprising: a gateway moduleincluding logic to interface to a vehicle management computer (VMC) viaa dual redundant standard data bus, wherein the gateway module comprisesredundant microcontrollers operably connected to the VMC for selectivelycontrolling supply of electrical power to a plurality of separateelectrical loads; two internal serial data buses, wherein the twointernal serial data buses are of two different types and the redundantmicrocontrollers are each operably connected to the two internal serialdata buses; and a plurality of Load Management Modules (LMMs), each LoadManagement Module operably connected to the internal serial data busesfor receiving control commands from the gateway module, wherein eachLoad Management Module comprises: a local microcontroller; a pluralityof power switching devices; and a plurality of application specificintegrated circuits (ASICs) corresponding to the plurality of powerswitching devices for interfacing the power switching devices to thelocal microcontroller, wherein each ASIC includes a voltage to frequencyconverter that converts a true RMS current value to a correspondingfrequency that is provided to the local microcontroller.
 2. Theelectrical power distribution center according to claim 1, wherein eachASIC includes an analog signal processing block that conditions a loadcurrent sense voltage across a sense resistor to produce the true RMScurrent value.
 3. The electrical power distribution center according toclaim 1, further comprising: an opto-coupler connected between the ASICand the local microcontroller that transmits the frequency to localmicrocontroller.
 4. The electrical power distribution center accordingto claim 1, wherein the local microcontroller uses an accumulator toconvert the frequency into a value representing true RMS current value.